Functional and non-CMOS-compatible materials

Functional materials add new and exciting functionality to MEMS, but the materials are not necessarily CMOS-compatible and are commonly avoided in silicon processing facilities. At SINTEF’s MiNaLab, a designated laboratory area allows us to work with piezoelectric materials, gold, platinum, and glass.

We use these materials in the realization of our devices. We also do feasibility studies and process development, and we offer foundry services for processing of glass, gold, and lead zirconate titanate (PZT). Examples of our services on functional materials are listed below.

PZT adds the ability of direct conversion between electrical energy and mechanical motion. This can be used both for sensing and actuating purposes in MEMS. SINTEF’s MiNaLab offers a foundry process with a patterned, 2 µm thick PZT film with a piezoelectric coefficient of -14 to -15 C/m². Custom-tailored processes can be developed. More information can be found on the homepages for MEMS-pie and NORD-pie, two recent projects within this area.

Gold has high reflectivity and is resistive to oxidative corrosion. This makes gold an excellent choice for coating optical surfaces, especially for applications using infrared light. In addition, the electrical and mechanical properties make gold an interesting material for chip mounting and soldering. SINTEF’s MiNaLab offers a foundry process for patterned Au with thickness ranging from about 50nm to 1 µm. Custom-tailored processes can be developed.

Glass has a number of different applications: as substrate material for devices requiring high electrical insulation, as encapsulation material for anodic wafer bonding and as substrate or encapsulation material for devices using visible optical communication. SINTEF’s MiNaLab offers patterning and bulk etching of glass wafers with custom-specific design.

Contact person: Hannah Tofteberg