Publications

Selected Publications.

Die-attach to Ceramic substrated for high temperature applications /Oldervoll, F.; Strisland, F. European Microelectronics and Packaging Symposium, Prague 16th-18th June 2004. - pp 6
STF90 S04622

Reliability issues for ceramic hybrids in high temperature environments / Oldervoll, F.; Strisland, F. IMAPS International Conference and Exhibition on High Temperature Electronics, Santa Fe 2004; HiTEC 2004. - pp 5

STF90 S04621

Wire-bond failure mechanisms in plastic encapsulated microcircuits and ceramic hybrids at high temperatures / Oldervoll, F.; Strisland, F. Microelectronics Reliability, Vol. 44(2004). - pp 1009-1015.
STF90 S04620

The I-ImaS project: End-user-driven specifications for the design of a novel digital medical imaging systems / Galbiati, A.; Metaxas, M.G.; Avset, B.S.; Bergamaschi, A.; Cavouras, D.; Evangelou, I.; Fant, A.; French, M.J.; Georgiou, H.; Hall, G.; Iles, G.; Longo, R.; Manthos, N.; Østby, J.M.; Pani, S.; Psomadellis, F.; Royle, G.J.; Schulerud, H.; Speller, R.D.; van der Stelt, P.F.; Theodoridis, S.; Triantis, F.; Turchetta, R.A.D. IEEE Medical Imaging Conference, Rome 19-22 october, 2004

STF90 S04611

Long term reliability of aluminium wire-bonding on ceramic substrates at high temperatures / Oldervoll, F.; Strisland, F. International Conference on High Temperature Electronics, Oxford, July 8-10, 2003; HITEN 2003

STF72 S03628

Thermo-mechanical behavior of a novel light modulator / Mo, Z.; Kristiansen, H.; Eliassen, M.; Li, S.; Liu, J. Electronic Components and Technology Conference, May 27-30, 2003, New Orleans, USA; ECTC53

STF72 S03626

Characterisation of anisotropic conductive adhesive compression during the assembly process / Walley, D.; Kristiansen, H.; Liu, J. International Electronic Packaging Technical Conference and Exhibition, July 6-11, 2003, Maui, Hawaii; IPACK03
STF72 S03625

A 500-dpi AC capacitive hybrid flip-chip CMOS ASIC/sensor module for fingerprint, navigation, and pointer detection with on-chip data processing / Vermesan, O.; Riisnæs, K.H.; Le-Pailleur, L.; Nysæther, J.B.; Bauge, M.; Rustad, H.; Clausen, S.; Blystad, L.-C.; Grindvoll, H.; Pedersen, R.; Pezzani, R.; Kaire, D. IEEE Journal of Solid-State Circuits, Vol. 38(2003)nr 12

STF72 S03615

A capacitive hybrid flip-chip ASIC and sensor for fingerprint, navigation and pointer detection / Vermesan, O.; Riisnæs, K.H.; Le-Pailleur, L.; Nysæther, J.B.; Bauge, M.; Rustad, H.; Clausen, S.; Blystad, L.-C.; Grindvoll, H.; Pedersen, R.; Pezzani, R.; Kaire, D. IEEE International Solid-State Circuits Conference 2003 : Digest of Technical Papers, San Francisco, February 9-13, 2003 ISSCC, vol. 46(2003). - pp 214-215

STF72 S03614

Design of high temperature electronics for well logging applications / Parmentier, B.; Vermesan, O.; Beneteau, L. International Conference on High Temperature Electronics, Oxford, July 8-11 2003; HITEN 2003

STF72 S03611

Layout techniques used to reduce the leakage currents in ASIC design for high temperature applications / Vermesan, O.; Blystad, L.-C.; Grindvoll, H. International Conference on High Temperature Electronics, Oxford, July 8-11 2003; HITEN 2003

STF72 S03610

CHICSi - a compact ultra-high vacuum compatible detector system for nuclear reaction experiments at storage rings / Carlén, L.; Avdeichikov, V.; Førre, G.; Golubev, P.; Jakobsson, B.; Kolozhvari, A.; Marciniewski, P.; Siwek, A.; Veldhuizen, E.J. van; Westerberg, L.; Whitlow, H.J.; Østby, J.M. Nuclear Physics Report ; LUNP 0103, February 2003

STF72 S03600

Selection of die-attach materials for high temperature electronics / Berg, M.; Oldervoll, F.; Nysæther, J.; Strisland, F. IMAPS Nordic Conference, Stockholm, 29. sept.-2. Oct. 2002

STF72 S02624

Characterisation of Mechanical Properties of Metal-Coated Polymer Spheres for Anisotropic Conductive Adhesive / Kristiansen, H.; Shen, Y.; Liu, J. Polytronic 2001, IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics , October 21-24, 2001. - pp 344-348

STF72 S01634

High Electric Stress and Insulation Challenges in Integrated Microelectronic Circuits / Oldervoll, F.; IEEE Electronical Insulation, Vol. 18(2002)no 1. - pp 16-20

STF72 S02602

Microelectronics Technologies Scaling and reliability – A Comparison Study of High Temperature and Radiation Hard Applications / Vermesan, O.; Blystad, L-C.; Grindvoll, H.; Jensen, G.U.; Avset Sundby, B.HITEN 2001, 5-8 June, Oslo

Packaging of a Silicon-Based Capacitive Differential Pressure Sensor for High Temperature Operation / Nysæther, J.B.; Strisland, F.; Moe, S.T.; Finsrud, J.M.; Mylvaganam, HITEN 2001, 5-8 June, Oslo

STF72 S01632

A High Temperature Sigma Delta Modulator ASIC / Vermesan, O.; Østby, J.M. International High Temperature Electronics Conference 5th, Albuquerque, NM, USA, June 12-15
STF72 S00654

Electrical and Mechanical Properties of Metal-coated Polymer Spheres for Anisotronic Conductive Adhesive / Brudberg, U.; Kristiansen, H.; Gulliksen, M. Polymeric Electronic Packaging ´99, Gothenburg, October, 1999

STF72 S99670

Overview of Display Conductive Adhesive Interconnection Technologies / Kristiansen, H.; Liu, J. Conductive Adhesive Electronics Packaging. - pp Chapter 15

STF72 S99668

Overview of Bumping Technology for Adhesive Flip-Chip Interconnect / Kristiansen, H.; Liu, J. IEEE Interpack, (1999) June

STF72 S99667

Electrical and Mechanical Properties of Metalcoated Polymer Spheres for Anisotropic Condutive Adhesive / Brudberg, U.; Kristiansen, H.; Gulliksen, M. Polymeric Electronic Packaging ´99, Gothenburg October 1999. - pp 63-71

STF72 S99666

Growth and Alloy Formation studied by Photoelectron Spectroscopy and STM / Berg, C.; Ramstad, A.; Strisland, F.; Raaen, S.; Worren, T.; Borg, A. Surface Science, Vol. 425(1999). – pp 57-67
STF72 S99607

Exceeding th Glass Temperature og Underfill Material in FCOB Circuits - the Impact on Solder Bump Lifetime under Thermal Cycling / Nysæther, J.; Lai, Z.; Liu, J. IEMT/IMT symposium, Omiya, Japan, April 1999. - pp 276-280

STF72 S99604

Enhanced Boiling Heat Transfer with Porous Silver Coatings for Electronics Cooling / Gulliksen, M.; Haugerud, H.; Kristiansen, H. Thermal Joint Conference, San Diego, USA, 15-19 March, 1999

STF72 S99628

Low Power ASIC for High Temperature Applications / Vermesan, O.; Rispal, T.; Soulier, L. IEEE High-Temperature Electronic Materials, Devices and Sensors Conference, San Diego, California, USA, IEEE, pp.81-85, 1998.